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| MSOP-10 packaging information reference pattern layout dimensions unit: mm packaging information / reference pattern layout dimensions
MSOP-10 ` /reel ?`?? /taping specifications ?`?? / ta p in g s p ecifications unit: mm 1,000pcs/reel direction of feed r type :[device orientation : right] standard feed 5.50.05 12.00.2 1.750.1 (5.0) MSOP-10 power dissipation power dissipation data for the MSOP-10 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. 1. measurement condition (reference data) condition : mount on a board ambient : natural convection soldering : lead (pb) free board : dimensions 40mm40mm 1600mm 2 in one side 1st inner metal layer about 50% tied to the pin 10 2nd inner metal layer does not exist 3rd inner metal layer does not exist 4th inner metal layer about 50% tied to the pin 10 each pin is tied to the copper traces material : glass epoxy fr-4 thickness : 1.6mm through-hole : 10 x 0.8 diameter evaluation board (unit: mm) 2. power dissipation vs. ambient temperature board mount (tjmax=125) ambient temperature ( ) power dissipation pd (mw) thermal resistance ( /w 25 500 85 200 200.00 rohs ? rohs com p liance ? ? item material note ?? ?? y?` /flammabilit y ratin g resin epoxy resin ul94v-0 `??` ~? lead frame copper alloy ?I U?`?? lead plating lead(pb) free solder plating ? ? die attach epoxy ???? au bonding wire ?? si silicon chip ?? `` marking laser marking MSOP-10 MSOP-10 perspective ver.10 |
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